标签：wrap any environ nts info ack baidu rman cal
链接：https://pan.baidu.com/s/1J6GDSN5i_Dr3tPK-wn8BQQ 密码：lyvb
IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012E incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.
IPC-6012E : Qualification and Performance Specific
标签：wrap any environ nts info ack baidu rman cal
原文地址：https://blog.51cto.com/526784/2474477
